Molded assembly with heating element captured therein
US6433317B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 7, 2000 |
| Grant date | Aug 13, 2002 |
| Priority date | — |
| Expiry date | Apr 7, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A heated element assembly and method of manufacturing heated element assemblies is provided. The heated element assembly including a first and second molded sections shaped to mate with each other is provided. A resistance heating element is secured between the first and second molded sections by an interference fit. The resistance heating element includes a piercable supporting substrate and a resistance wire sewn thereon. The resistance wire is disposed in a predetermined circuit path which is substantially encompassed by the first and second molded sections. The resistance heating element is easily fixed in a position between the first and second molded sections and is capable of providing heat on vertical, horizontal and contoured surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.