Interconnection for integrated high voltage electronic devices
US6433416B1 · kind B1 · utility
1Cited by
5References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 5, 2001 |
| Grant date | Aug 13, 2002 |
| Priority date | — |
| Expiry date | Jan 5, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device for the interconnection of at least two electronic elements separated by at least one buffer zone. The interconnection includes one or more interconnection tracks for the elements, which tracks are perforated at least in parts of the track or tracks situated above the buffer zones.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.