Patent · US Expired

Method and apparatus of interconnecting with a system board

US6433562B1 · kind B1 · utility

4Cited by
11References
24Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 28, 1998
Grant dateAug 13, 2002
Priority date
Expiry dateAug 28, 2018

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01R1/045
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A method and apparatus of interconnecting with a system board is presented. A system board having a metal stiffener mounted thereon is provided with an opening in the stiffener to provide access to an area of interest on the system board. A probe test assembly is positioned at the opening and secured to the stiffener when testing is desired to provide access to the pins of the device under test (e.g., a Multi Chip Module (MCM) on the system board). Alternatively, a system enhancement device, such as a MCM or Single Chip Module (SCM) having additional Central Processing Units (CPU's) or other features, may be installed on the system board at the opening in the stiffener to enhance the function of the system board. Another alternate includes an interface assembly positioned at the opening in the stiffener. A cover is positioned at the opening and secured to the stiffener at all other times.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.