Semiconductor device having heat radiating member
US6434006B1 · kind B1 · utility
12Cited by
12References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 2, 2001 |
| Grant date | Aug 13, 2002 |
| Priority date | — |
| Expiry date | May 2, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor device has a case, a printed circuit board, a fin, and a ceramic substrate mounting a semiconductor element thereon. The case contains the printed circuit board, the ceramic substrate and the fin. The fin and the case radiate heat transmitted from the ceramic substrate. The fin has protrusions on a contact face facing a contact face of the case. The fin contacts the case though the protrusions when the fin is fixed to the case. The protrusions serve as heat radiating path.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.