Electronic module for chip card
US6435414B1 · kind B1 · utility
7Cited by
5References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 22, 1999 |
| Grant date | Aug 20, 2002 |
| Priority date | — |
| Expiry date | Nov 22, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention concerns an electronic module that is designed to be fixed in an electronic device in the form of a card. The module includes a medium having at least a surface provided with contact pads and a microcircuit which is fixed on the medium and has exit hubs each connected to a medium contact pad. The connections between the exit hubs and the contact pads consist of a cord made of an adhesive conductive substance which conforms to the profile of the medium. Preferably, the conductive substance is a conductive isotropic adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.