Multilayered ceramic substrate serving as ink manifold and electrical interconnection platform for multiple printhead dies
US6435653B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2001 |
| Grant date | Aug 20, 2002 |
| Priority date | — |
| Expiry date | Oct 5, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49401
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
An inkjet pen includes a multilayered platform, an electrical interconnection extending through the multilayered platform, and a plurality of printhead dies each mounted on the multilayered platform. The multilayered platform includes a first layer having an ink inlet defined therein, a second layer having a plurality of ink feed slots defined therein, and at least one third layer having an ink manifold defined therein. The ink manifold of the at least one third layer fluidically couples the ink inlet of the first layer with the ink feed slots of the second layer. Each of the printhead dies are mounted on the second layer of the multilayered platform and include an array of printing elements and an ink refill slot communicating with the array of printing elements. The ink refill slot of each of the printhead dies communicates with at least one of the ink feed slots of the multilayered platform, and each of the printhead dies are electrically coupled to the electrical interconnection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.