Magnetic finishing apparatus
US6435948B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 9, 2001 |
| Grant date | Aug 20, 2002 |
| Priority date | — |
| Expiry date | Oct 9, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A finishing apparatus having magnetically responsive finishing elements that can be smaller than the workpiece being finished are disclosed. The finishing apparatus supplies a parallel finishing motion to finishing elements solely through magnetic coupling forces. The finishing apparatus can supply multiple different parallel finishing motions to multiple different finishing elements solely through magnetic coupling forces to improve finishing quality and versatility. The new magnetic finishing methods, apparatus, and magnetically responsive finishing elements can help improve yield and lower the cost of manufacture for finishing of workpieces having extremely close tolerances such as semiconductor wafers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.