Process and apparatus for improved module assembly using shape memory alloy springs
US6436223B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 16, 1999 |
| Grant date | Aug 20, 2002 |
| Priority date | — |
| Expiry date | Feb 16, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53978
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A fixture and process for assembly of semiconductor modules. Each module comprises a substrate and a cover attached to the substrate. The fixture comprises a baseplate adapted to accept the substrate and a spring-loading device containing a shape memory alloy spring engaging the cover. The shape memory alloy spring exerts a lesser force at room temperature and an elevated force at the bonding temperature of the bonding agent used to attach the cover to the substrate. The process comprises the steps of (a) loading she module into an assembly fixture and aligning a shape memory alloy spring over the module at room temperature; (b) placing the fixture and module into a heating chamber; (c) heating the fixture and module to a temperature sufficient for bonding and above the shape memory alloy spring transition temperature range so that the spring exerts an elevated force on the module; and (d) cooping the fixture and module below the transition temperature so that the spring exerts a lesser amount of force on the module, and disengaging the springs at the lower temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.