Plasma resistant composition and use thereof
US6436605B1 · kind B1 · utility
14Cited by
36References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 12, 1999 |
| Grant date | Aug 20, 2002 |
| Priority date | — |
| Expiry date | Jul 12, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0043
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The reactive ion etching resistance of radiation sensitive resist composition is enhanced by adding at least one organometallic compound to a radiation sensitive polymer. The resist composition can be patterned and used as mask for patterning an underlying layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.