Process flow for ARS mover using selenidation wafer bonding before processing a media side of a rotor wafer
US6436794B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 21, 2001 |
| Grant date | Aug 20, 2002 |
| Priority date | — |
| Expiry date | May 21, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An improved process flow for an atomic resolution storage (ARS) system deposits conductive electrodes on a media side of a rotor wafer before wafer thinning process, i.e., grinding and CMP, thus protecting the conductive electrodes on a media surface from the grinding process. In addition, the CMOS circuitry is formed in a stator wafer at a relatively later stage. Therefore, the CMOS circuitry is less likely to be damaged by heat processing. In addition, some of the necessary processing may be performed with loosened thermal budget. Finally, because wafer bonding of the rotor wafer and the stator wafer is performed at a later stage, there is less probability of degradation of the wafer bonding. Accordingly, device yield may be enhanced, leading to lower manufacturing cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.