Method of producing contact structure
US6436802B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 14, 2000 |
| Grant date | Aug 20, 2002 |
| Priority date | — |
| Expiry date | Dec 19, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4015
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of producing a contact structure having contactors on a semiconductor substrate by a microfabrication technology for achieving an electrical connection with a contact target. The method includes the steps of: providing a substrate made of dielectric or semiconductor material; forming an interconnect trace on the substrate either by deposition or plating; applying microfabrication processes for forming a contactor having a base portion vertically formed on the interconnect trace, a horizontal portion whose one end is formed on the base portion and a contact portion vertically formed on another end of the horizontal portion, and attaching a sphere contact to a top end of the contact portion of the contactor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.