Microstructures
US6436853B1 · kind B1 · utility
75Cited by
41References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2001 |
| Grant date | Aug 20, 2002 |
| Priority date | — |
| Expiry date | Feb 27, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16235
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A method for making a microstructure assembly, the method including the steps of providing a first substrate and a second substrate; depositing an electrically conductive material on the second substrate; contacting the second substrate carrying the electrically conductive material with the first substrate; and then supplying current to the electrically conductive material to locally elevate the temperature of said electrically conductive material and cause formation of a bond between the first substrate and the second substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.