Hardener for epoxy molding compounds
US6437026B1 · kind B1 · utility
10Cited by
3References
25Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 5, 2001 |
| Grant date | Aug 20, 2002 |
| Priority date | — |
| Expiry date | Jan 5, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention is directed to novel epoxy molding compounds for the encapsulation of microchips in the electronics industry. Known epoxy molding encapsulants are generally prepared from a blend epoxy resins, phenol hardeners, silica fillers, catalysts, flame retardant materials, processing aids and colorants. The addition of polybenzoxazines as a co-reactant with one or several epoxy resins provides a product with reduced moisture adsorption while maintaining a high glass transition temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.