Semiconductor package with internal heat spreader
US6437437B1 · kind B1 · utility
26Cited by
12References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 3, 2001 |
| Grant date | Aug 20, 2002 |
| Priority date | — |
| Expiry date | Jan 3, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A semiconductor package is provided that includes a substrate having a top surface, a cover, and at least one semiconductor device attached to the top surface of the substrate. The cover is secured to the substrate so as to create a space between the interior surface and the substrate such that the semiconductor device resides within the space. The cover has an interior surface comprising a plurality of micro-channels. A wick is positioned in confronting relation to the plurality of micro-channels and the semiconductor device, with a two-phase vaporizable liquid disposed within the space.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.