Low profile high density rack mountable enclosure with superior cooling and highly accessible re-configurable components
US6437980B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 17, 2000 |
| Grant date | Aug 20, 2002 |
| Priority date | — |
| Expiry date | Oct 17, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/20
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A low profile high density rack mountable enclosure with superior cooling and highly accessible re-configurable components is disclosed. One embodiment of the present invention discloses a computer system comprising a chassis for holding a plurality of computer components, a CPU having a heatsink mounted thereon, wherein the CPU is mounted in the chassis, and a first blower having an inlet for receiving air and an outlet for expelling air, wherein the first blower is mounted in the chassis proximate to the CPU. Another embodiment of the present invention discloses a retention clip for use in a computer system, the retention clip comprising a base portion having at least one tab, and a flange portion having at least one mounting hole, wherein the flange portion is connected to the base portion, and wherein the flange portion makes an angle with the base portion. Another embodiment of the present invention discloses a computer enclosure comprising a chassis having a left side, a right side, and a bottom side, wherein a rear edge of the bottom side includes an open hem, a top panel, wherein a rear edge of the top panel includes an open hem, and a rear panel having a left side, a right…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.