Thermally enhanced microcircuit package and method of forming same
US6437981B1 · kind B1 · utility
74Cited by
25References
26Claims
0Family size
Assignee
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Key dates
| Filing date | Nov 30, 2000 |
| Grant date | Aug 20, 2002 |
| Priority date | — |
| Expiry date | Nov 30, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1461
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A thermally enhanced microcircuit package includes a microcircuit package having a microcircuit device cavity that receives a microcircuit device. A microelectromechanical (MEMS) cooling module is operatively connected to the microcircuit package and forms a capillary pumped loop cooling circuit having an evaporator, condenser and interconnecting cooling fluid channels for passing vapor and fluid between the evaporator and condenser and evaporating and condensing the cooling fluid. The evaporator is operatively associated with the microcircuit device for cooling the device when in use.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.