Disposable electronic chip device and process of manufacture
US6437985B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2000 |
| Grant date | Aug 20, 2002 |
| Priority date | — |
| Expiry date | Mar 24, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An electronic chip device includes an interface support film having a support film and at least one flat conductive interface placed on the support film, as well as a microcircuit connected to the interface. The interface support film possesses such properties that it can be creased or folded on itself without deterioration. The support film possesses a thickness of less than 75 &mgr;m, the best results being obtained with a thickness of between 10 &mgr;m and 30 &mgr;m. Preferably the support film is selected from among polypropylene (PP), polyethylene (PE), polyethylene teraphtalate (PET). In one embodiment, the device includes a compensation film placed on the support film. The compensation film has a recess containing the microcircuit and its connections. The recess can contain a material to encapsulate the microcircuit and its connections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.