Directional coupling memory module
US6438012B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 12, 2000 |
| Grant date | Aug 20, 2002 |
| Priority date | — |
| Expiry date | May 12, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C5/04
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Conventionally, wiring length occupied by a directional coupler decides intervals between modules connected to a bus, and those intervals can not be shortened furthermore. Accordingly, the intervals between modules are wide and high-density mounting is not possible. In the present invention, a directional coupler in a memory bus is formed by a leader line from a controller and a leader line from a memory chip and contained within a memory module. Accordingly, pitch between the modules can be reduced and high-density mounting can be realized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.