Optical wiring layer, optoelectric wiring substrate, mounted substrate, and methods for manufacturing the same
US6438281B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2000 |
| Grant date | Aug 20, 2002 |
| Priority date | — |
| Expiry date | Mar 30, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16225
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A first clad layer is formed on a smooth support substrate via a release layer. On the first clad layer, a core through which light propagates and alignment marks are simultaneously formed. Further, these layers are covered with a second clad to obtain an optical wiring layer. Then, the optical wiring layer is released from the support substrate and stuck to a substrate having an electric wiring. Subsequently, on the resulting substrate are formed a mirror for reflecting light propagating through the core, pads for installing optical parts or the like, and via holes for electrically connecting the electric wiring on the substrate to the pads. For this formation, the alignment marks are used as references.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.