Polishing composition and polishing method employing it
US6440186B1 · kind B1 · utility
43Cited by
5References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 15, 2001 |
| Grant date | Aug 27, 2002 |
| Priority date | — |
| Expiry date | Aug 15, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23F3/06
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A polishing composition comprising:(a) an abrasives(b) a compound to form a chelate with copper ions(c) a compound to provide a protective layer-forming function to a copper layer,(d) hydrogen peroxide, and(e) water,wherein the abrasive of component (a) has a primary particle size within a range of from 50 to 120 nm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.