Method of making integrated circuit having a micromagnetic device
US6440750B1 · kind B1 · utility
75Cited by
11References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 23, 2000 |
| Grant date | Aug 27, 2002 |
| Priority date | — |
| Expiry date | Feb 23, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/325
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing an integrated circuit and an integrated circuit employing the same. In one embodiment, the method of manufacturing the integrated circuit includes (1) conformally mapping a micromagnetic device, including a ferromagnetic core, to determine appropriate dimensions therefor, (2) depositing an adhesive over an insulator coupled to a substrate of the integrated circuit and (3) forming the ferromagnetic core of the appropriate dimensions over the adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.