Semiconductor device
US6440773B1 · kind B1 · utility
28Cited by
11References
24Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 12, 2000 |
| Grant date | Aug 27, 2002 |
| Priority date | — |
| Expiry date | Jun 12, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An IC card strong against bending and with a thin semiconductor chip mounted thereon is disclosed which is further provided with a reinforcing plate to reduce damage of the semiconductor chip caused by a point pressure. The IC card is employable even under a mechanically severe environment and is thus highly reliable.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.