Process flow for ARS mover using selenidation wafer bonding after processing a media side of a rotor wafer
US6440820B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 21, 2001 |
| Grant date | Aug 27, 2002 |
| Priority date | — |
| Expiry date | Jul 13, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01Q80/00
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An improved process flow for an atomic resolution storage (ARS) system deposits conductive electrodes, together with a protective layer, on a media side of a rotor wafer before most of other device processing, thus preserving a surface for ARS storage media from subsequent wafer thinning process. CMOS circuitry is also formed in a stator wafer at a later stage. Therefore, the CMOS circuitry is less likely to be damaged by heat processing. In addition, processing of the media side of the rotor wafer may be performed with loosened thermal budget. Finally, because the media side of the rotor wafer is processed before wafer bonding of the rotor wafer and the stator wafer, there is less probability of degradation of the wafer bonding. Therefore, device yield may be enhanced, leading to lower manufacturing cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.