Semi-conductive compositions for wire and cable
US6441084B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2000 |
| Grant date | Aug 27, 2002 |
| Priority date | — |
| Expiry date | Apr 11, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/014
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Semi-conductive compositions useful for extrusion coating wire and cable are provided. The semi-conductive extrusion coating compositions of the invention utilize a base resin containing linear low density polyethylene and a combination of a higher structure conductive carbon black and a lower structure conductive carbon black. The linear low density polyethylene may be combined with other polyolefin resins, such as low density polyethylene. The resulting semi-conductive compositions have a useful balance of processability and thermomechanical stability and physical/mechanical properties making make them particularly well-suited for use as conductive layers for power cable constructions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.