Inserted components for via connection of signal tracks to achieve continuous impedance matching in multi-layer substrate
US6441319B1 · kind B1 · utility
6Cited by
4References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2000 |
| Grant date | Aug 27, 2002 |
| Priority date | — |
| Expiry date | Dec 28, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A technique for connecting signal tracks within a multi-layer substrate is disclosed. In one embodiment, the technique is realized by providing an opening in a substrate and fitting an inserted component into the opening. The inserted component comprises a dielectric block mounted to a lead frame. The lead frame is conductive such that a signal layer formed between the inserted component and the substrate connects signal tracks on multiple signal layers of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.