Ultra-low-loss feedthrough for microwave circuit package
US6441697B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 27, 1999 |
| Grant date | Aug 27, 2002 |
| Priority date | — |
| Expiry date | Jan 27, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
RF feedthroughs for use with monolithic microwave integrated circuits (MMIC) are installed in environmentally protective or hermetically sealed packages that provide electromagnetic shielding. A feedthrough for an MMIC package has a dielectric substrate, a microstrip or transmission line formed on the substrate for transmitting high frequency electronic signals and a wall disposed above the transmission line and the substrate. The wall of the feedthrough has a varying thickness so that the narrowest portion of the wall is disposed on the transmission line substantially perpendicular to the substrate. The transmission line also has a varying width so that the narrowest width portion of the transmission line crosses the narrowest portion of the wall. The narrowest portion of the wall may be created by placing two oppositely facing concaved surfaces on each side of the wall. To reduce parasitic capacitance, the substrate and the wall may each have an air cavity embedded in respective bodies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.