Cooling unit for cooling heat generating component and electronic apparatus having the cooling unit
US6442025B2 · kind B2 · utility
33Cited by
12References
15Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jan 3, 2001 |
| Grant date | Aug 27, 2002 |
| Priority date | — |
| Expiry date | Jan 3, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/203
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A cooling unit for cooling a semiconductor package has a heat sink and an electric fan device. The heat sink includes a heat receiving portion for heat generated by the semiconductor package, and a heat exchange portion thermally connected to the heat receiving portion. The heat exchange portion is located adjacent to the heat receiving portion and separate from the semiconductor package. The heat sink is movable toward and away from the semiconductor package, and always urged by a plate spring toward the semiconductor package. The electric fan device sends cooling air at least to the heat exchange portion of the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.