Stake attached contact assembly in an integrated circuit socket assembly
US6442045B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 7, 2001 |
| Grant date | Aug 27, 2002 |
| Priority date | — |
| Expiry date | Nov 7, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1084
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for securing a contact assembly to a frame in an integrated circuit socket via cold forming. A plurality of posts are integrally formed with and extend from the bottom surface of the frame of an integrated circuit device socket. The contact assembly includes a plurality of conductive columns mounted within an insulating sheet in a predetermined contact pattern. The insulating sheet also has a plurality of post receiving apertures that are selectively positioned such that the posts extend through corresponding apertures in the insulating sheet when the contact assembly is positioned in a mounting position on the bottom surface of the frame. The posts are cold staked to expand the diameter of the post ends and to secure the contact assembly to the frame. Integral spacer abutments are provided on the bottom surface of the frame to provide a planar mounting surface for the socket and to precisely space the insulating sheet from the printed circuit board when the socket is mounted to the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.