Method for coupling a circuit board to a transmission line that includes a heat sensitive dielectric
US6442832B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 7, 2000 |
| Grant date | Sep 3, 2002 |
| Priority date | — |
| Expiry date | Dec 15, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53422
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A preferred method for coupling a transmission line to a circuit board includes the steps of: providing a circuit board with a first side and an opposing second side; dispensing solder upon the first side of the circuit board; providing a first coupler having a conductive lead portion and a ductile conductive tube portion extending from the conductive lead portion; engaging the conductive lead portion with the solder dispensed upon the first side of the circuit board; heating the circuit board, the solder and the conductive lead portion so that the solder reflows, thereby securing the first coupler to the first side of the circuit board; inserting an extremity of the first conductor into the ductile conductive tube portion; and crimping the ductile conductive tube portion so as to provide crimped retention of the first conductor therein. Circuit boards, devices and systems also are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.