Chip-carrier for improved drop directionality
US6443557B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 29, 1999 |
| Grant date | Sep 3, 2002 |
| Priority date | — |
| Expiry date | Oct 29, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/03
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A carrier frame having an aperture and a nozzle plate disposed on the carrier frame and positioned over the aperture is described. The nozzle plate has at least one nozzle formed between opposing surfaces of the nozzle plate. The carrier frame and the nozzle plate are made from materials having dissimilar thermal expansion coefficients such that the carrier frame has a thermal expansion coefficient that is less than the thermal expansion coefficient of the nozzle plate. The nozzle plate is staked to the carrier frame and then baked so that the nozzle plate shrinks during the baking process thereby becoming taught and under a state of tensile stress. The nozzle is formed in the nozzle plate after the baking process by laser ablation, for example. The nozzle thus formed has a true bore due to the taught nozzle plate and the opposed surfaces of the nozzle plate being parallel to each other. Consequently, a nozzle camber angle measured relative to a nozzle axis and defined by an angular displacement between a center point of symmetry on an input side of the nozzle and a center point of symmetry on an output side of the nozzle is coaxially aligned with the nozzle axis. By eliminating di…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.