Optical module with solder bond
US6443631B1 · kind B1 · utility
15Cited by
76References
36Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 20, 2001 |
| Grant date | Sep 3, 2002 |
| Priority date | — |
| Expiry date | Feb 20, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4239
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical module for use in an optical device is provided which includes an optical component. The optical component is bonded to a relative reference mount which can be attached to couple to a fixed reference mount. The bond is formed by solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.