Polishing head of a chemical mechanical polishing apparatus and, retainer ring of the same
US6443826B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2000 |
| Grant date | Sep 3, 2002 |
| Priority date | — |
| Expiry date | Jul 27, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A retainer ring of a polishing head of a CMP apparatus facilitates the removal of contaminants, such as slurry debris, which have found their way into the polishing head. The retainer ring includes an annular ring body, and a plurality of contaminant outlets extending from the inner peripheral surface of the ring body to the outer peripheral surface of the ring body. Inner openings defined at the inner peripheral surface of the ring body and outer openings defined at the outer peripheral surface of the ring body by the contaminant outlets are horizontally elongated slots. Also, each of the contaminant outlets consists of a plurality of inner holes and an outer hole which is joined to the plurality of inner holes. The contaminant outlets occupy at least 30% of the radially innermost peripheral surface along a line extending circumferentially along the surface. The CMP apparatus itself includes a polishing head having such a retainer ring and a washing unit having a nozzle for spraying deionized water through the contaminant outlets of the retainer ring toward an inner space formed in the polishing head.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.