Method for bonding an active tag to a patch and a tire
US6444069B1 · kind B1 · utility
32Cited by
35References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 15, 1999 |
| Grant date | Sep 3, 2002 |
| Priority date | — |
| Expiry date | Sep 15, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T152/10819
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for bonding an active tag to a patch and assembling the patch to a tire is set forth. A patch assembly and a method for securing an electronic monitoring device having electronic and mechanical components for monitoring at least one engineering condition within a tire, comprising an rigid tag assembly encapsulating the electronic monitoring device, bonded to a vulcanized rubber patch which is secured to the inner cavity of a tire utilizing a layer of dual cure bonding rubber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.