Method for enhancing the solderability of a surface
US6444109B1 · kind B1 · utility
15Cited by
8References
8Claims
0Family size
Inventors
Key dates
| Filing date | Oct 26, 2000 |
| Grant date | Sep 3, 2002 |
| Priority date | — |
| Expiry date | Jan 17, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/007
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, ampihateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.