Micro-etch solution for producing metal surface topography
US6444140B2 · kind B2 · utility
8Cited by
45References
50Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 17, 1999 |
| Grant date | Sep 3, 2002 |
| Priority date | — |
| Expiry date | Mar 17, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/124
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Metal surfaces, particularly copper surfaces, which are oxidatively micro-etched to increase surface area through the use of molybdenum. The micro-etch solutions contain a proton source, e.g., a mineral acid, an oxidizer agent, e.g., hydrogen peroxide, an azole compound, and a molybdenum source.These micro-etched surfaces can further be rendered acid-resistant by exposure to a thiazole compound and/or a thiocarbamide compound. The thiazole compound and/or thiocarbamide compound may be provided either in the oxidative micro-etching solution or provided in a post-micro-etching solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.