Single-packaged epoxy resin coating composition
US6444272B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 26, 2000 |
| Grant date | Sep 3, 2002 |
| Priority date | — |
| Expiry date | May 26, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31529
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a single-packaged epoxy resin coating composition comprising:(A) an epoxy resin having at least one epoxy group in a molecule and capable of being dissolved in the following organic solvent (D),(B) a ketimines compound having at least two primary amino groups blocked with a carbonyl compound and having no other amino groups than the above blocked amino groups,(C) a dehydrating agent and(D) an organic solvent,wherein the above organic solvent (D) comprises a hydrocarbon base solvent selected from the group consisting of an aliphatic hydrocarbon base solvent and an aromatic hydrocarbon base solvent having a boiling point of 148° C. or higher in a proportion of at least 95% by weight based on the above organic solvent (D).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.