Method and apparatus for manufacturing printed wiring board
US6444379B1 · kind B1 · utility
2Cited by
3References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 3, 1999 |
| Grant date | Sep 3, 2002 |
| Priority date | — |
| Expiry date | Dec 3, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03G2215/00518
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
There are provided a method for preparing a printed wiring board which can form electrostatic latent images at the desired positions of a substrate with good precision, and a uniform and good image can be formed for preparing a printed wiring board having circuits on the both surfaces of the substrate from a material to be developed having at least a metal conductive layer and a photoconductive layer on both surfaces of an insulating substrate in this order, and a preparation device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.