Process of fabricating electronic microcomponent of the variable capacitor or microswitch type
US6444488B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 15, 2001 |
| Grant date | Sep 3, 2002 |
| Priority date | — |
| Expiry date | May 15, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01H1/0036
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Process for fabricating electronic components, of the variable capacitor or microswitch type, comprising a fixed plate (1) and a deformable membrane (20) which are located opposite each other, which comprises the following steps, consisting in:depositing a first metal layer on an oxide layer (2), said first metal layer being intended to form the fixed plate;depositing a metal ribbon (10, 11) on at least part of the periphery and on each side of the fixed plate (1), said ribbon being intended to serve as a spacer between the fixed plate (1) and the deformable membrane (20);depositing a sacrificial resin layer (15) over at least the area of said fixed plate (1);generating, by lithography, a plurality of wells in the surface of said sacrificial resin layer;depositing, by electrolysis, inside the wells formed in the sacrificial resin (15), at least one metal region intended to form the deformable membrane (20), this metal region extending between sections of the metal ribbon (10, 11) which are located on each side of said fixed plate (1);removing the sacrificial resin layer (15).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.