Patent · US Expired

Low dielectric materials and methods of producing same

US6444715B1 · kind B1 · utility

63Cited by
9References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 6, 2000
Grant dateSep 3, 2002
Priority date
Expiry dateJun 9, 2020

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/259
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

In accordance with the present invention, compositions and methods are provided in which the mechanical strength and durability of a precursor material having a plurality of pores is increased by a) providing a precursor material; b) treating the precursor material to form a nanoporous aerogel, preferably by using a supercritical drying process; c) providing a blending material having a reinforcing component and a volatile component; d) combining the nanoporous aerogel and the blending material to form an amalgamation layer; and e) treating the amalgamation layer to increase the mechanical strength of the layer by a substantial amount, and to ultimately form a low dielectric material that can be utilized in various applications.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.