Fine and micro-machining process for workpieces by means of laser beams
US6444948B1 · kind B1 · utility
7Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2000 |
| Grant date | Sep 3, 2002 |
| Priority date | — |
| Expiry date | Jun 1, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/389
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A process and device are disclosed for fine and micro-machining workpieces by means of laser beams. The process is conducted in several stages and the device has a modular design. The process and device make it possible to generate highly uniform cut seams or grooves, to set the required conicity, to work in a highly accurate and reproducible manner and give a great freedom of design during machining.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.