Patent · US Expired

Fine and micro-machining process for workpieces by means of laser beams

US6444948B1 · kind B1 · utility

7Cited by
5References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 1, 2000
Grant dateSep 3, 2002
Priority date
Expiry dateJun 1, 2020

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB23K26/389
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

A process and device are disclosed for fine and micro-machining workpieces by means of laser beams. The process is conducted in several stages and the device has a modular design. The process and device make it possible to generate highly uniform cut seams or grooves, to set the required conicity, to work in a highly accurate and reproducible manner and give a great freedom of design during machining.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.