Photo sensing device and the manufacturing method thereof
US6445008B1 · kind B1 · utility
3Cited by
6References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2001 |
| Grant date | Sep 3, 2002 |
| Priority date | — |
| Expiry date | Oct 25, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A photo sensing device uses surface-emitting LED as light emitter to increase responsive of light receiver and prevent the short circuit of connection wires, and the manufacturing method thereof. The light emitter is directly mounted on top front surface of an encapsulating epoxy enclosing a light receiver. The light emitted from backside of the light emitter passes through the encapsulating epoxy and is directly absorbed by the light receiver. The response is enhanced as compared with prior art.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.