Semiconductor device
US6445064B1 · kind B1 · utility
58Cited by
7References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2001 |
| Grant date | Sep 3, 2002 |
| Priority date | — |
| Expiry date | Jul 18, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a first semiconductor package and a second semiconductor package which is mounted onto the first semiconductor package. The first semiconductor package has lands on an upper surface for mounting the second semiconductor package and lands on the lower surface for external connection, which are used for connection with a mounting substrate. The second semiconductor package has external leads which are connected to the lands for mounting the second semiconductor package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.