Snap in heat sink shielding lid
US6445583B1 · kind B1 · utility
18Cited by
22References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2001 |
| Grant date | Sep 3, 2002 |
| Priority date | — |
| Expiry date | Mar 23, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A construction and method are provided for electronically shielding an electronic component and for removing heat generated by the component. The construction and method involve the use of a shielding can, formed with EMI shielding material that surrounds the electronic component and a lid or cap that both contacts and forms a heat sink with the component and also provides a shielding effect as it acts as the cap for the shielding can.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.