Heat exchanger for an electronic heat pump
US6446442B1 · kind B1 · utility
92Cited by
16References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 31, 2001 |
| Grant date | Sep 10, 2002 |
| Priority date | — |
| Expiry date | Jul 31, 2021 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF25B2500/01
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat exchanger 17 for an electronic heat pump 11 includes a thermally conductive base plate 18 having first and second surfaces, the first surface being flat and adapted to make intimate surface contact with a surface of the electronic heat pump and the second surface being obverse to the first surface and supporting an array of thermally conductive fins 21. The adjacent fins 21 define there between a plurality of micro channels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.