Logic module refrigeration system with condensation control
US6446447B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2001 |
| Grant date | Sep 10, 2002 |
| Priority date | — |
| Expiry date | Jun 29, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B30/70
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A refrigeration system includes an evaporator housing sealed to a first side of a circuit board containing a logic module, the evaporator housing including an evaporator block in thermal communication with the logic module. The evaporator housing further includes at least a humidity sensor for detecting a humidity within the evaporator housing. In another aspect of the invention, the refrigeration system includes a heater on a second side of the circuit board opposite the evaporator housing, the heater being in thermal communication with plated through-holes of the circuit board to maintain the circuit board above local ambient temperature. In another aspect of the invention, a source of dry pressurized air is provided into the sealed evaporator housing through a though-hole drilled directly under the logic module. In another aspect of the invention, a portion of the warm air exiting the processor cage is recirculated and caused to pass over the evaporator housing, thereby ensuring that the exterior surface of the evaporator housing is warming to above local dew point. In another aspect of the invention, two or more modular, interchangeable refrigeration units are concurrently conn…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.