Method of fabricating an electronic module or label, module or label obtained and medium including a module or label of this kind
US6446874B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2000 |
| Grant date | Sep 10, 2002 |
| Priority date | — |
| Expiry date | Mar 24, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a method of fabricating at least one electronic module or label which is adapted to be rendered adhesive. The method includes the following steps: an insulative film is supplied including at least one contact and/or antenna type interface, and an adhesive tape is supplied including an activatable adhesive and a removable protective film. The tape includes at least one perforation corresponding to the area of the resin on the module or label. The adhesive tape is applied to the support film so that the perforation coincides with the area of the resin and the adhesive is activated so that it fixes the tape to the film. The coating resin is dispensed over the intended area at least within the perforation and in contact with the perforation. The invention also provides a method in which the activatable adhesive is deposited with no protection film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.