Test socket for an electronic assembly which reduces damage to the electronic assembly
US6447322B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2000 |
| Grant date | Sep 10, 2002 |
| Priority date | — |
| Expiry date | Oct 3, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/0458
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A test socket for an electronic assembly comprising a holder, a plurality of electric terminals, a heat sink, a compliant and thermally conductive thermal interface component, and a heat sink biasing device is provided. The holder has a formation to receive the electronic assembly. The electric terminals are located on the holder, each for making contact with a respective electric contact and the electronic assembly to test an integrated circuit of the electronic assembly. The heat sink is secured to the holder. The thermal interface component is attached to a surface of the heat sink. The heat sink biasing device has a first portion connected to the holder and a second portion connected to the heat sink, the second portion being biased relative to the first portion to move the heat sink from a loading position wherein the electronic assembly is insertable into the holder, to a testing position wherein the heat sink is located next to the electronic assembly with the thermal interface component between the surface of the heat sink and the electronic assembly and contacting the electronic assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.