Programmable nanometer-scale electrolytic metal deposition and depletion
US6447663B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 24, 2000 |
| Grant date | Sep 10, 2002 |
| Priority date | — |
| Expiry date | Apr 18, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/899
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of nanometer-scale deposition of a metal onto a nanostructure includes the steps of: providing a substrate having thereon at least two electrically conductive nanostructures spaced no more than about 50 &mgr;m apart; and depositing metal on at least one of the nanostructures by electric field-directed, programmable, pulsed electrolytic metal deposition. Moreover, a method of nanometer-scale depletion of a metal from a nanostructure includes the steps of providing a substrate having thereon at least two electrically conductive nanostructures spaced no more than about 50 &mgr;m apart, at least one of the nanostructures having a metal disposed thereon; and depleting at least a portion of the metal from the nanostructure by electric field-directed, programmable, pulsed electrolytic metal depletion. A bypass circuit enables ultra-finely controlled deposition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.