Pressure-sensitive adhesive
US6447900B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 27, 1999 |
| Grant date | Sep 10, 2002 |
| Priority date | — |
| Expiry date | Sep 27, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2891
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides a pressure-sensitive adhesive having a storage modulus from 1×105 to 1×106 dyne/cm2 and at a frequency of 1 Hz; and having a gel fraction of 55% or more when the storage modulus is measured at a temperature of 25° C. in dynamic viscoelasticity measurement. Its pressure-sensitive adhesive product can be obtained by the process, for example, for producing the (meth)acrylate emulsion-type pressure-sensitive adhesive which comprises adding the polymerization-initiator(s) at separate multi-steps to the present reaction system in the presence of polymerization-initiator(s) at the time of polymerizing alkyl (meth)acrylate and which comprises using a water-soluble polymerization-initiator at least one time during or after the second step of adding the polymerization-initiator(s).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.