Hot melt adhesives for dermal application
US6448303B1 · kind B1 · utility
151Cited by
4References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 29, 2000 |
| Grant date | Sep 10, 2002 |
| Priority date | — |
| Expiry date | Dec 29, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J153/00
- WIPO fieldPharmaceuticals
- WIPO sectorChemistry
Abstract
A pressure sensitive hot melt adhesive composition which comprises a high molecular weight rubber and less than about 60 parts by weight of a liquid diluent, and has a G′ of less than about 15×104 dynes/cm2 at 10 rad/s at 25° C. is useful for adhesive skin application (e.g., surgical tape), including transdermal drug delivery applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.